在半导体制造过程中，温度是一个至关重要的参数，因为温度监测对于保证良好的晶圆质量和性能至关重要，需要进行全面的温度监控，以确保其品质和性能。

仪器化晶圆（热电偶、粘合晶圆或RTD）在半导体加工设备中具有广泛的应用，其中了解和控制晶圆表面的温度至关重要。智测电子的仪器化晶圆被广泛应用于多个行业，包括快速热处理（RTP）、快速热退火（RTA）、曝光后烘烤（PEB）、化学气相沉积（CVD）、物理气相沉积（PVD）、离子注入、太阳能电池等众多热驱动过程。

我们的晶圆测温系统将提高关键制造设备的运行时间，配合软件使用，将工艺流程中的温度的均匀性和变化可视化展示。您将获得晶圆的完整温度分布图，并持续监测温度变化，和工艺温度分布相对应。

智测电子晶圆测温系统可以根据您的需求进行定制。您可以选择晶圆尺寸、晶圆基板（不同材料）、传感器数量和位置、导线长度、温度范围和导线终端类型，满足不同使用需求。

In semiconductor manufacturing, temperature is a critical parameter for ensuring the quality and performance of wafers. Comprehensive temperature control is needed during the process.
The Instrumented Wafer (Thermocouples, Bonded Wafer or RTDs) finds application in semiconductor processing equipment where knowing and controlling the temperature at the surface of a wafer is critical. ZHICE-ELEC’s instrumented Wafers are being used in many industries including applications such as Rapid Thermal Processing (RTP), Rapid Thermal Annealing (RTA), Post Exposure Bake (PEB), Chemical Vapor Deposition (CVD), Physical Vapor Deposition (PVD), ION Implantation, Solar Cell, and many other thermally driven processes.
The Instrumented Wafer will improve the uptime of critical manufacturing equipment and show you process uniformity. The temperature sensor directly embedded, enables you to perform direct in-situ wafer temperature measurements. The software will visualize the temperature distribution. You will have a complete temperature profile of the wafer and continuous temperature changes monitoring to correlate with your process temperature profile.
ZHICE ELEC offers customization services according to your needs. You choose the wafer size, wafer substrate (different material), quantity and location of sensors, wire lengths, temperature range, and wire termination type.

智测电子推出新品：晶圆测温系统

温度采集软件 ZCDAQ TEMP

高精度测温模块

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